Hybrid microcircuit technology handbook : materials, processes, design, testing and production /
Collection : Materials science and process technology series Mention d'édition :2nd ed. Détails physiques : 1 online resource (xxi, 579 pages) : illustrations. ISBN :159124255X (electronic bk.); 9781591242550 (electronic bk.); 9780815514237; 0815514239; 9780815519843 (electronic bk.); 0815519842 (electronic bk.).Integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines is also present.
Includes bibliographical references and index.
Description based on print version record.
Introduction -- Substrates -- Thin Film Processes -- Thick Film Processes -- Resistor Trimming -- Parts Selection -- Assembly Processes -- Testing -- Handling and Clean Rooms -- Design Guidelines -- Documentation and Specifications -- Failure Analysis -- Multichip Modules: A New Breed of Hybrid Microcircuits -- References -- Index.
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Electronic reproduction. [S.l.] : HathiTrust Digital Library, 2010. MiAaHDL
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