Handbook of semiconductor manufacturing technology
Mention d'édition :2nd ed. Publié par : CRC Press (Boca Raton) Détails physiques : 1 v. (various pagings) ill. 26 cm. ISBN :1574446754 (hardcover); 9781574446753 (hardcover). Année : 2008Type de document | Site actuel | Cote | Statut | Date de retour prévue | Code à barres | Réservations |
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Livre | La bibliothèque des sciences de l'ingénieur | 621.381 52 DOE (Parcourir l'étagère) | Disponible | 0000000018400 |
Survol La bibliothèque des sciences de l'ingénieur Étagères Fermer l'étagère
621.381 52 DAB Predictive simulation of semiconductor processing | 621.381 52 DAB Predictive simulation of semiconductor processing | 621.381 52 DEV The physics of semiconductor microcavities | 621.381 52 DOE Handbook of semiconductor manufacturing technology | 621.381 52 GAN Intense terahertz excitation of semiconductors | 621.381 52 GHA Einstein relation in compound semiconductors and their nanostructures | 621.381 52 MAY Fundamentals of semiconductor manufacturing and process control |
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on… Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
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